Technology

Cu Clip refers to copper strip, copper sheet

Clip Bond refers to strip bonding, is a packaging process that uses a solid copper bridge bonded to solder to connect die and lead.

The company Currently has two bonding modes:

1.Full clip bonding mode
●   Both Gate pad and Source pad are clip bonding mode. This bonding mold has high cost and complex process, which can obtain better Rdson and better thermal effect.

2.Cu clip and wire bonding mode
●   The source pad is clip bolding mode, and the gate pad is wire bonding mode. This bonding mode is slightly cheaper than the full clip, saving the wafer area (applicable to the very small area of the gate), and the process is simpler than the full clip, which can obtain better Rdson and better thermal effect.

3.Impedance comparison of several different bonding materials

Technical Characteristics

Compared with the traditional bonding package, the advantages of Cu Clip technology are as follows:

1.The connection between the die and the lead is made of Cu clip, which replaces the standard wire bonding method between the die and the lead to a certain extent. Therefore, unique package resistance value, higher Current volume and better thermal conductivity can be obtained.

2.There is no need for Ag plating at the bonding position of the lead, which can fully save the cost inCurred by Ag plating and poor Ag plating.

3.The product package is completely consistent with the normal product.

Application Field

The products are mainly used in servers, portable computers, batteries/drivers, graphics cards, motors, power supplies and other fields.